12/31/2023 0 Comments Coffeecup web form builder 7.6![]() 7–241.Ĭlasson, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing. New York: Von Nostrand Reinhold, 1989, pp. ![]() 257–265.Ĭlark, Raymond H., Printed Circuit Engineering: Optimizing for Manufacturability. 59–101, 317–342.Ĭhatterton, Paul A., and Houlden, Michael A., EMC: Electromagnetic Theory to Practical Design. 92.īuchanan, James E., Signal and Power Integrity in Digital Systems: TTL, CMOS, & BiCMOS. 76.īuchanan, James, CMOS/TTL Digital Systems Design. Upper Saddle River, NJ: Prentice Hall PTR, 2003, pp. 56, 57, 76.īrooks, Douglas, Signal Integrity Issues and Printed Circuit Board Design. Englewood, CO: Cardiff Publishing, 1992, pp. 21–29.īreed, Gary A., RFI/EMI/EMC: A Designer's Handbook. Electrostatic Discharge and Electronic Equipment. Motorola Semiconductor Products, 1983, pp. 16.18–16.21.īlankenhorn, James C., PCB Design of High-Speed Digital Circuits. Herts, UK: Radio Society of Great Britain, 1994, pp. 448–486.īiddulph, Dick, Radio Communication Handbook, 6 th Edition. Englewood Cliffs, NJ: Prentice-Hall, 1970, pp. 416–421.īell Telephone Laboratories, Physical Design of Electronic Systems: Volume II Materials Technology. B., Circuits, Interconnections, and Packaging for VLSI. 190.Īxelson, Jan, Making Printed Circuit Boards. A., Reliability & Maintainability of Electronic Systems. Boston, MA: Kluwer Academic Publishers, 2002, pp. 4-1–4-3.Īrchambeault, Bruce R., PCB Design for Real-World EMI Control. Unitrode Power Supply Design Seminar SEM-1200. ![]() Sunnyvale, CA: Power Integrations, 2000, pp. The Best of Analog Dialogue 1967 to 1991. Newington, CT: American Radio Relay League, 2002, pp. The ARRL Handbook for Radio Communications 2003. Nashua, NH: Teradyne Connection Systems, 1984, pp. Teradyne Printed Circuit Backplane Design Guide. Reference Data for Radio Engineers, 6 th Edition. New York: International Telephone and Telegraph, 1949, pp. ![]() Reference Data for Radio Engineers, 4 th Edition. Practical Design Techniques for Power and Thermal Management. Cleveland, OH: Keithley Instruments, 1998, pp. Boxborough, MA: Compliance Design, 1996, pp. Boxborough, MA: Compliance Design, 1995, pp. Boxborough, MA: Compliance Design, 1993, pp. 4-104–4-106.ĭesigning for Immunity to Pulsed EMI. This process is experimental and the keywords may be updated as the learning algorithm improves.Īpplications Guide to EMI, RFI, ESD Solutions. These keywords were added by machine and not by the authors. If the board is going into equipment, where we only need to make a few units, and we have a very-tight deadline, a. The rest will be minor wiring changes, maybe with a patch PALinstalled to fix logic and signal-level errors. Most of these corrections will be components that we must change or add-for which we have provided “ wiggle room” in the circuits and the PCB layout-so they will only require changing the bill-of-material and the assembly drawing. If this is a first-pass board, we can expect to find a few things that aren't quite perfect, and that we will want to tweak. If we do a careful, thorough job of printed circuit board ( PCB) layout, the rest of our development effort should be fairly straightforward-at least as far as the electronics are concerned. Welcome to the most important part of this book-actually designing our printed circuit boards! We've spent Chapters 4 through 30, with numerous side trips to Appendices A through U, preparing for this step.
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